| http://www.w3.org/ns/prov#value | - Further, this scrub member 24 has a surface for contacting and scrubbing the wafer W. It is formed by for example a soft brush-like material, sponge-like material, or a porous material so as not to cause a scratch etc. in the surface of the wafer W. For example, there can be mentioned a porous body made of a resin such as a urethane resin, a melamine resin, an epoxy resin, or polyvinyl acetal (PVA
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