| http://www.w3.org/ns/prov#value | - Such methods as substitution plating, electroplating and electroless plating are available for coating the particle surfaces of the unsteady-shaped electroconductive powder or the powder having an aspect ratio of 5 or less with silver, but substitution plating is preferred because of high adhesion between the unsteady-shaped electroconductive powder or the powder having an aspect ratio of 5 or les
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