| http://www.w3.org/ns/prov#value | - uting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devicesUS742333820 Nov 20069 Sep 2008Micron Technology, Inc.Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit diceUS742333920 Nov 20069 Sep 2008Mircon Technology, Inc.Methods for stacking wire-bonded integrated circuit dice
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