| http://www.w3.org/ns/prov#value | - Further, in the instance in which mounting substrate 30 is formed of plastic, additive fillers such as carbon, silica, aluminum nitride, feldspar, and/or any other known filler commonly used in the art, may be utilized to lower the coefficient of thermal expansion (CTE) to be approximately the same coefficient of thermal expansion (CTE) as light emitting device display chip 14 so that when light e
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