| http://www.w3.org/ns/prov#value | - Further, in case where the loop coil 34 is used in a process for forming adhering substances 40 on a surface exposed to a plasma due to a process such as film formation and etching so as to measure the plasma generation condition and the ratio at which the high frequency is absorbed and shielded by the adhering substances 40 on the insulator 12, this raises the following problem: in the loop coil
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