| http://www.w3.org/ns/prov#value | - Further, in the case of the methods in which, after a recess is formed in the obverse surface of a substrate, the member for forming nozzles, the ejection pressure generation elements, a semiconductor circuit, such as the circuit for driving the ejection pressure generation elements, etc., are formed, and then an ink supply hole is formed from the reverse side of the substrate, it is necessary to
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