| http://www.w3.org/ns/prov#value | - Furthermore, since a Coulomb's force-based adhesion (electrostatic adhesion) process and a conventional wiring pattern formation process are used in the adhesion step in the chip attachment and the subsequent connection step of the chip with the wiring pattern, i.e. since a ???solder which can adversely affect environmental conditions???, which was conventionally used in the prior art, is not used
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