| http://www.w3.org/ns/prov#value | - Further, there is no wiring outside the sealing portion 15 at a portion where the upper substrate 1 and the lower substrate 5 oppose each other, and the upper substrate 1 and the lower substrate 5 are cut from others at a position along the sealing portion except the side of the upper substrate 1 where the electrode driving ICs are mounted, so that the external shapes of sides of the substrates ma
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