| http://www.w3.org/ns/prov#value | - Further, since the number of the thin film wiring layers can be decreased, the multi-layered wiring substrate can be formed thin to reduce the thickness and the size of the semiconductor module. [0126] Further, electric equipments mounted with the multi-chip module, for example, portable terminals such as portable telephones, personal computers, car navigations, digital/analog cameras or video cam
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