| http://www.w3.org/ns/prov#value | - Referring again to FIGS. 1A and 1B, before a reliable connection can be made to the external connection points 18, the external connection points 18 must be mechanically abraded in such a manner as to create a surface that is rough enough prevent the conductive epoxy 14 from forming an insulating layer, but not so rough as to damage the fragile semiconductor surface of the chip 10.
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