| http://www.w3.org/ns/prov#value | - Heating may be to any suitable temperature, such as from about 150??? C. to about 260??? C. The applied heat causes the solder material 410 a to shrink and coalesce to produce coalesced solder from oxide removal, and/or conductive particle melting, thus enhancing the ability of the resulting coalesced solder structure 410 b to bond and electrically connect to conductive region 160.
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