PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • FIG. 2 is a side elevational view of the overall apparatus of the present invention for bonding the leads of FIG. 1 to the substrate of FIG. 1, showing a bonder and the improved compensating system of the present invention;
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