| http://www.w3.org/ns/prov#value | - As shown in FIG. 17, the first plurality of solder bumps 174, preferably highly thermally conductive material such as a lead, tin, indium, gallium, bismuth, cadmium, zinc, copper, gold, silver, antimony, germanium, and alloys thereof, most preferably indium-based and tin-based solder, is formed across an entire wafer 170 before the microelectronic die 114 is diced therefrom.
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