About: http://webisa.webdatacommons.org/338312397

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention provides a no-flow underfill material and process suitable for underfilling flip chips and other bumped components employed in harsh environments.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com