PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The substrate is then thinned from the back side using a thinning process, such as chemical mechanical planarization (CMP) or etching, to expose the conductive members.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com