PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • (2) According to the present invention, there is also provided a method of fabricating a leadframe capable of mounting a plurality of kinds of semiconductor chips having different sizes thereon, comprising the steps of:
http://www.w3.org/ns/prov#wasQuotedFrom
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