About: http://webisa.webdatacommons.org/338820947

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The invention relates to a semiconductor device, and more particularly to a semiconductor device having a chip size package (hereinafter, referred to as CSP) structure.
http://www.w3.org/ns/prov#wasQuotedFrom	freshpatents.com