About: http://webisa.webdatacommons.org/339153440

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 4 is a plan view illustrating the relationship between a mold and a lead frame when a semiconductor device of a first embodiment according to the present invention is plastically packaged with a resin;
http://www.w3.org/ns/prov#wasQuotedFrom	google.com.au