| http://www.w3.org/ns/prov#value | - joining chips utilizing copper pillarUS8067837Jun 17, 2005Nov 29, 2011Megica CorporationMetallization structure over passivation layer for IC chipUS8072070Jun 29, 2009Dec 6, 2011Megica CorporationLow fabrication cost, fine pitch and high reliability solder bumpUS8097947Feb 28, 2008Jan 17, 2012Micron Technology, Inc.Conductive systems and devices including wires coupled to anisotropic conductive f
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