About: http://webisa.webdatacommons.org/339732030

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	A plastic resin of an epoxy type can be used in the insulation layer. [0018] Another embodiment of the present invention is a method for manufacturing a semiconductor package.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com