| http://www.w3.org/ns/prov#value | - In the sputtering film-forming process using such a target, a sputtering machine is preferably vented to a degree of vacuum (ultimate vacuum) of preferably 1??10???3 Pa or less and more preferably 1??10???4 Pa or less to create an atmosphere in which water in the sputtering machine and impurities such as an organic gas generated from the base have been removed.
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