About: http://webisa.webdatacommons.org/341433841

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In this embodiment, the material of the carrier 21 is a silicon wafer, and the material of the bottom dielectric layer 31 is polyimide (DuPont PT-2611) with a low dielectric constant (less than 4).
http://www.w3.org/ns/prov#wasQuotedFrom	google.es