About: http://webisa.webdatacommons.org/341478710

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In case of performing the CMP process, such a polishing material as silica, alumina or ceria of which particle size ranges from about 50 nm to about 300 nm is used for implementing the CMP process.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com