About: http://webisa.webdatacommons.org/342211718

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	After anodic bonding, the unwanted portions of the covering wafer can be removed by sawing, laser cutting, etching, or other suitable techniques, to leave covering structures over selected microstructures.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com