| http://www.w3.org/ns/prov#value | - Accordingly, there is an urgent need for low-melting, highly volatile and relatively air and thermal stable ruthenium and osmium organometallic compounds as source reagents for various CVD applications, such as the formation of bottom electrodes, diffusion barriers, conductors, superconductors, dielectrics, capacitors, protective coating and catalytic metal alloy films.
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