| http://www.w3.org/ns/prov#value | - ve second emitter film by applying conductive ultra-fine particles on the first emitter film and baking the ultra-fine particles; and (g) exposing a tip portion of the second emitter film on a side of the flat upper surface area of the first emitter film, by etching and removing an unnecessary portion including a portion of the first emitter film near the flat upper surface area. 2.
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