| http://www.w3.org/ns/prov#value | - Electrical leads 240, 242, 244, and 246 for making electrical connection to the chip from outside the package are formed of a thin film, thick film, or other suitable conductor geometry of, e.g., a titanium nitride film, a reaction formed film such as reaction bonded titanium nitride, zirconium nitride, or other conductive nitride, or other suitable conductive material.
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