| http://www.w3.org/ns/prov#value | - eposition method for forming a film including metal, nitrogen and carbonUS75213799 Oct 200721 Abr 2009Applied Materials, Inc.Deposition and densification process for titanium nitride barrier layersUS7537804 *28 Abr 200626 May 2009Micron Technology, Inc.Material formed over substrate with pulse sequence comprises first and second metals, and at least a portion of material is product from reaction o
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