| http://www.w3.org/ns/prov#value | - 2002Dec 30, 2003Amkor Technology, Inc.Integrated circuit package mountingUS6740971Nov 5, 2001May 25, 2004Micron Technology, Inc.Cavity ball grid array apparatus having improved inductance characteristicsUS6756666Dec 13, 2000Jun 29, 2004Nec CorporationSurface mount package including terminal on its sideUS6798113Apr 18, 2002Sep 28, 2004Hewlett-Packard Development Company, L.P.Flexure with integral
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