| http://www.w3.org/ns/prov#value | - e stage and the reversing device, and reversing the workpiece. [0038] According to the eleventh aspect of the present invention, it is possible to shorten the time required to transfer a workpiece to be polished, such as a semiconductor wafer, to the top ring, for thereby greatly increasing the number of processed workpieces per unit time, i.e., throughput. [0039] The above and other objects, feat
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