| http://www.w3.org/ns/prov#value | - er exposing a pad of the circuit structure, and a bonding pad over the pad exposed by the opening, a wire bonded to the bonding pad and to the BGA substrate, a polymer material, such as epoxy based material, benzocyclobutane (BCB) or polyimide, on the top surface of the BGA substrate, covering the semiconductor chip and the wire, and a lead-free solder ball on a bottom surface of the BGA substrate
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