| http://www.w3.org/ns/prov#value | - ep 7, 2004Samsung Electronics Co., Ltd.Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor packageUS6836009 *Aug 28, 2002Dec 28, 2004Micron Technology, Inc.Packaged microelectronic componentsUS6841863 *Dec 27, 2002Jan 11, 2005Hynix Semiconductor Inc.Ball grid array package with stacked cen
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