| http://www.w3.org/ns/prov#value | - Referring to FIG. 2E, a conductive material such as aluminum, tungsten, or polysilicon is deposited on the entire surface and then patterned to form node contact wire layers 47a and 47b and a bitline contact wire layer 47c over the cell region and poly pad wire layers 47d to 47g contacting with poly pads 44d to 44g, respectively, over the core and periphery regions, thus completing the process ste
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