| http://www.w3.org/ns/prov#value | - Next, by the transfer arm 34, the wafer W is suitably loaded into the substrate processing unit 12 or 13, performing the cleaning of the back face of the wafer W, removal of the peripheral part of the surface of the wafer W and also cleaning of the peripheral part of the wafer W. Further, the wafer W is suitably loaded into the substrate cleaning unit 14 or 15 where contaminants, such as particles
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