| http://www.w3.org/ns/prov#value | - Next, substrate 500 is bonded to base layer 508 via sacrificial layer 506 as shown in FIG. 5E. [0048] Device layer 501 and landing pads 504 generally comprise a device 520, which may be released by removing sacrificial layer 506 as shown in FIG. 5F. Sacrificial layer 506 may be removed by any suitable method, such as wet etch or other isotropic etch process. [0049] Other variations on the above de
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