| http://www.w3.org/ns/prov#value | - Heat sink 10 can be mounted to electronic component 100 by conventional means, such as by mounting directly to electronic component 100 using an adhesive, such as a pressure sensitive or thermally activated adhesive (something which the relatively low weight of graphite permits); mounting to a thermal interface, if present, such as by an adhesive; or mounting to the board or other object on which
|
