| http://www.w3.org/ns/prov#value | - 2Dec 18, 2003Tongbi JiangSemiconductor device assemblies and packages including multiple semiconductor devices and methods* Cited by examinerNon-Patent CitationsReference1 *Tummala et al., Microelectronics Packaging Handbook Semiconductor Packaging Part II, Chapman and Hall, 2<SUP>nd </SUP>Ed., 1997, pp. 25-26, 42-44, 91-93, 887-890.* Cited by examinerReferenced byCiting PatentFiling datePublicati
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