| http://www.w3.org/ns/prov#value | - e module including die and inverted land grid array package stacked over ball grid array packageUS727936113 Mar 20069 Oct 2007Chippac, Inc.Method for making a semiconductor multi-package module having wire bond interconnect between stacked packagesUS735161012 Ene 20071 Abr 2008Chippac, Inc.Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed
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