| http://www.w3.org/ns/prov#value | - Second, when present fin fabrication techniques are applied to produce thin fins, the resultant fins are weakly attached to the supporting substrate.Therefore, there is a need for a method of fabricating FinFETs having very thin fins that have sidewall surfaces that are crystallographically close to perfect and that overcomes the inherent structural weakness of thin fins.SUMMARY OF INVENTIONA firs
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