| http://www.w3.org/ns/prov#value | - eenth embodiment; FIG. 54 is a graph of a relation between a heating temperature and a reaction rate of a resin sheet in the eighteenth embodiment; FIG. 55 is a perspective view of an electronic component mounting apparatus used in the sixteenth embodiment; FIG. 56A, FIG. 56B, FIG. 56C and FIG. 56D are a perspective view showing a position recognizing operation on the component side of the electro
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