| http://www.w3.org/ns/prov#value | - Next, as shown in FIG. 1C, a barrier film 103 is formed on the surface of the interlayer insulation film 102 and in the contact holes CH and the interconnection grooves M. This barrier film 103 is formed by a material such as Ta, Ti, W, Co, Si, Ni, an alloy of compounds of these metals with nitrogen or phosphor such as TaN, TiN, WN, CoW, COWP, TiSiN, NiWp, or others, or a stack of films comprised
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