| http://www.w3.org/ns/prov#value | - e placed on the first and the second lead frames and a loop shaped supporting portion connected to the base and placed on the first bonding wires and under the second bonding wires; wherein the semiconductor element is supported by the fixing member and the first and the second lead frames. [0044] An eleventh aspect of the present invention is a method for producing a semiconductor device having a
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