| http://www.w3.org/ns/prov#value | - Besides, the semiconductor wafer 1 a is prevented from warping, because the photosensitive organic material is formed uniform in thickness without becoming thick in the bottom of the V-shaped groove VG Next, a metal layer of thickness of about 3 ??m made mainly of aluminum or copper is formed to cover the second glass substrate 6 and the V-shaped groove VG formed by the notching, as shown in FIG.
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