About: http://webisa.webdatacommons.org/35140350

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The copper interconnect may be formed by a technique including CVD, sputtering, plating, or other suitable processes.
http://www.w3.org/ns/prov#wasQuotedFrom	freshpatents.com