| http://www.w3.org/ns/prov#value | - The embodiment of FIG. 6 also utilizes a membrane 250 having at least one opening or orifice 265, and in addition to controlling the pressure to achieve the desired material removal from the wafer front-side surface, a flow of air or other gas is adjusted to maintain a layer of air (or gas) between the wafer backside surface 244 and the outer membrane surface 256.
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