About: http://webisa.webdatacommons.org/353311685

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Accordingly, there is a need for an improved process for forming the through-wafer interconnects in the die 20.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com