| http://www.w3.org/ns/prov#value | - In this embodiment, return manifold structure 270 is a thermally conductive material, such as a metal (e.g., copper or aluminum), diamond, silicon, SiC, or AIN, and is sealed to the periphery of electronic device 220 using, for example, a solder band (which is a good thermal conductor) around the perimeter of the electronic device 220.
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