About: http://webisa.webdatacommons.org/356714199

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Referring now to FIG. 1I, a singulated semiconductor die 206 is conventionally mounted via suitable mounting means, such as epoxy, to the die attach pad 202, and the epoxy is cured.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es