| http://www.w3.org/ns/prov#value | - Bond pads 34 of first semiconductor device 30 a communicate with corresponding contact areas 24 of substrate 20 by way of discrete conductive elements 38 a, such as the illustrated bond wires, tape-automated bond (TAB) elements comprising traces carried on a flexible dielectric film, other thermocompression bonded leads, and other known types of conductive elements.
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