About: http://webisa.webdatacommons.org/357625670

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	To sum up, the present invention is a simple process for manufacturing an electroless Ni-P and a solder bump on a chip.
http://www.w3.org/ns/prov#wasQuotedFrom	google.ca